Slicing and Wafer Cutting Machines

 Standard Compliance:

It has Available in 4 types depending on the hardness of the sample

Model Number:-D200

Roller Type Pneumatic Motorized Manual

Furthermore, cross-sectional samples can be cut using

To remove the thickness of test specimens of thermoplastic polyethylene material having a width between: 12.5 mm & 150 mm with thickness not exceeding 10 mm

0.8 to 2.0 mm

1.0 +/- 0.2 mm

Slicing machine for PVC AND XLPE samples using motorized roller high precision blades cutting system for reducing the thickness of the specimen and cross-sectional cutting of samples

Frequently asked questions:-

What is Slicing and Wafer Cutting?

In the case of the multicar stalling silicon, large slabs are grown which are then sliced up into smaller ingot blocks Once an ingot has been grown it is then sliced up into a wafer

How do you cut a wafer?

In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated the dicing process can involve scribing and breaking, mechanical sawing or laser cutting.